Capability
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( High Tg210 ) |
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Rigid Board Capability
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Item
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Parameter
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| Base Material Thk. | D.S. | 0.2-6.0mm |
| MLB | 0.4-6.0mm | |
| Max. Board Size | D.S. | 700*1200mm |
| MLB | 700*1200mm | |
| Monthly Capacity | Rigid PCB | 10,000 ㎡ |
| Hole Dia. Tolerance | NPTH | ±0.05mm |
| PTH | ±0.076mm | |
| Min. Hole Diameter | 0.1mm | |
| Min. Hole to Hole Tol. | ±1mil | |
| Min. L/Width L/spacing | 3 mil | |
| Solder Mask Hardness | ≥6H | |
| Surface Finish | Immersion gold/Immersion Silver/Immersion tin/Lead-free HASL/Gold plating/OSP etc... | |
| Outline Tolerance | CNC Rout | ±0.1mm |
| Punch | ±0.13mm | |
| V-cut Min. Board Thk. | 0.4mm | |
| E-test | Voltage:10-300v;Insulation Resistance:1-20MΩ; | |
| Peel off Strength | 1.4N/mm | |
| Thermal shock Resistance | 260℃ 10sec 3times | |
| Flammability Rate | 94V-0 | |
| Warp and Twist | ≤1% | |
| Quality Standard | GB4588.2;GB4588.4;IPC-600G, Class II/AQL-Ⅱ | |
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Printed Circuit Board Assembly (PCBA) Capability
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Equipment
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Model |
Manufacturer
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Quantity
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Parameter
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| SMT Lines |
-
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-
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4
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-
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| DIP Lines |
-
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-
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1
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-
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| SMT Machine |
YG12
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YAMAHA
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4
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For chip components such as resistors, capacitors, etc.. Speed: 36,000CPH |
| SMT Machine |
YG12F
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YAMAHA
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4
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For IC, BGA, etc.. Speed: 11,000CPH |
| Automatic Screen Printing Machine |
MARK-II
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MINAMI
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2
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-
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| Reflow Soldering Machine |
NS-800II
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JT
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2
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-
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| Reflow Soldering Machine |
1809 MK3
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HELLER
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2
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Overall Length: 183” (465 cm). 9 Heated Zones. 2 Cooling Zones |
| Wave Soldering Machine |
KK-350 II
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JT
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2
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-
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| AOI |
BF18D-P40
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SAKI
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1
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Desktop High speed Automated Optical Inspection machine. Inspection items: missing, shift, miss alignment, reverse, polarity, other component, bridge, dirt, dust, no solder, short solder, cold solder, lifted chip, lifted lead, un insertion, OCR: optical character recognition/verification. After Printing Process: No solder paste, excess, blur, scratch, short, shift, bridge. |
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Flexible Board Capability
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Item
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Parameter
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| Base Material | Polyimide | 12.5um、25um、50um |
| Polyester | 100um | |
| Copper Thickness | 18um、35um、70um | |
| Monthly Capacity | 10,000㎡/month | |
| No. of Layers | 1-8 layers | |
| Max. Board Size | S/S D/S M. Board | 500*500mm |
| NPTH | ±0.05mm | |
| Hole Dia. Tolerance | PTH | ±0.076mm |
| Min. Hole Diameter | 0.10mm | |
| Min. L/W L/Spacing | 3mil | |
| Min. Annular Ring Width | 4mil | |
| Surface Finish Immersion | Immersion gold/Immersion silver/Immersion tin/Gold plating/Tin plating/OSP | |
| Min. Outline Tolerance | ±0.05mm | |
| E-test | Voltage):10-300v;(Insulation Resistance):1-20MΩ; | |
| Insulation Resistance | 1011Ω | |
| Peel off Shock Resistance | 1.0N/mm | |
| Thermal shock Resistance | 260℃ 10sec 3times | |
| Flammability Rate | 94V-0 | |
| Quality Standard | IPC-6013A, Class II | |
